Development of Coated-Wire Bonding Technology.

Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages

In 1998, Carsem introduced the MLP (Micro Leadless Package). Today, the MLP has become the semiconductor industry’s package of choice for many devices with low-tomedium I/O count. Coincidentally, the MLP came out at the same time that smartphones were just starting to take off. Following the tremendous increase in market demand for smartphones, tablets and other handheld devices, the MLP soon o...

Palladium - coated and Bare Copper Wire Study for Ultra - Fine Pitch Wire Bonding

Wire bonding using copper wire

Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...

Assembly Using X-WireTM Insulated Bonding Wire Technology

As the semiconductor industry continues to move towards higher pin count, finer pitch, multi-row and multistack devices, wire bonding becomes an increasing challenge for today’s advanced packaging processes. Insulated bonding wire technology, known as X-WireTM, has been identified on the 2006 ITRS Roadmap for Semiconductors [1], as a viable, cost-effective solution to enable complex package des...

Overview of wire bonding using copper wire or insulated wire

Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...